{"id":9490,"date":"2024-11-12T17:12:03","date_gmt":"2024-11-12T08:12:03","guid":{"rendered":"https:\/\/connect.nissha.com\/filmdevice\/?page_id=9490"},"modified":"2026-11-09T11:35:31","modified_gmt":"2026-11-09T02:35:31","slug":"semi-additive-process","status":"publish","type":"page","link":"https:\/\/connect.nissha.com\/filmdevice\/en\/sap","title":{"rendered":"Semi-Additive Process"},"content":{"rendered":"
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\u25b7 Inquiry<\/a><\/div>\n<\/div>\n
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NISSHA is developing the SAP process.
\nWe add high value to the flexible substrates utilizing fine patterning technology.
\nThe technology may be applicable to various products such as transparent antennas.<\/p>\n<\/div>\n

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Features<\/h2>\n
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High transparency<\/h3>\n

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High optical transparency is enabled by fine patterning capability and intrinsic optical properties of substrate material, COP.<\/p>\n<\/div>\n

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Narrower and thicker trace patterning<\/h3>\n

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Both low electrical resistance and narrow line width are attained due to fine patterning and plating technologies.<\/p>\n<\/div>\n

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Large area<\/h3>\n

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Our current manufacturing line consists of both roll-to-roll and sheet-to-sheet processes. We will be launching a fully roll-to-roll line that can process 500mm width webs for mass production.<\/p>\n<\/div>\n<\/div>\n<\/div>\n

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Comparison between SAP And Subtractive Process<\/h2>\n<\/div>\n<\/div>\n<\/div><\/div><\/div>
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SAP has the following features compared to subtractive process.<\/p>\n

\u30fbNarrow traces can be patterned
\n\u30fbThickness of Cu can be adjusted
\n\u30fbRectangular cross section of traces<\/p>\n\n\n\n\n\n\n\n\n\n
<\/th>\nSAP
\n(under development)<\/b><\/th>\n		Subtractive process
\n(NISSHA conventional process)<\/b><\/th>\n<\/tr>\n
Process flow<\/th>\n\"\"<\/td>\n\"\"<\/td>\n<\/tr>\n
Base film<\/th>\nCOP, PET, PI, etc.<\/td>\nCOP, PET, PI, etc.<\/td>\n<\/tr>\n
Plating material<\/th>\nCu<\/td>\nVarious metals such as ITO, Cu, Ni,etc., and their alloys<\/td>\n<\/tr>\n
Mask size<\/th>\nMax 500\u00d7600mm<\/td>\nMax 500\u00d7600mm<\/td>\n<\/tr>\n
Trace width<\/th>\n5\u03bc\uff4d
\n* Contact Nissha<\/td>\n		10\u03bc\uff4d
\n* Contact Nissha<\/td>\n<\/tr>\n
Patterning
process<\/th>\n		Single-sided
\n*Double-sided patterning is
\nunder development<\/td>\n		Single-sided and
\ndouble-sided<\/td>\n<\/tr>\n<\/tbody>\n<\/table>\n<\/div>\n<\/div><\/div><\/div><\/div><\/div>
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NISSHA is developing the metal mesh pattaning process for transparent antennas<\/h2>\n<\/div>\n<\/div>\n<\/div><\/div><\/div><\/div><\/div>
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\u30fbFine wire mesh<\/b>
\nWe have achieved 2.5\u03bcm width with less than 5\u03bcm thickness.<\/p>\n

\u30fbBlackend copper mesh<\/b>
\nWe are developing the blackennig process that contributes to the reduction of mesh visibility.<\/p>\n

\u30fbAnti-star-effect pattern<\/b>
\nWe can design the anti-star-effect pattern.<\/p>\n<\/div>\n<\/div><\/div><\/div><\/div>

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Applications<\/h2>\n
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Transparent antenna<\/h3>\n<\/div>\n
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Transparent LED light<\/h3>\n<\/div>\n
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Coil alternative FPC<\/h3>\n<\/div>\n<\/div>\n<\/div>\n
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Process with lower environmental impact<\/h2>\n

Copper consumption is expected to be reduced for 70% by changing the process from Subtractive to Semi-Additive.<\/p>\n

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*Estimate conditions
\n10\u03bcm thick Cu, traces cover 30% of the entire surface.<\/p>\n<\/div>\n

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Inquiries about Semi-Additive Process (SAP)<\/h2>\n
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Please feel free to contact us for any questions or concerns.<\/p>\n

CLICK<\/a><\/p>\n<\/div>\n<\/div>\n<\/div>\n<\/div>\n<\/div><\/div><\/div><\/div><\/div>","protected":false},"excerpt":{"rendered":"

\u25b7 Inquiry NISSHA is developing the SAP process. We add […]<\/p>\n","protected":false},"author":7,"featured_media":0,"parent":0,"menu_order":0,"comment_status":"closed","ping_status":"closed","template":"page-force_sensors5_en.php","meta":{"_acf_changed":false,"footnotes":""},"class_list":["post-9490","page","type-page","status-publish","hentry"],"acf":[],"aioseo_notices":[],"aioseo_head":"\n\t\t\n\t\n\t\n\t\n\t\t\n\t\t