{"id":863,"date":"2019-05-17T09:18:03","date_gmt":"2019-05-17T00:18:03","guid":{"rendered":"https:\/\/connect.nissha.com\/ime\/?page_id=863"},"modified":"2026-01-27T15:39:09","modified_gmt":"2026-01-27T06:39:09","slug":"en","status":"publish","type":"page","link":"https:\/\/connect.nissha.com\/ime\/en\/","title":{"rendered":"Insert Molding with Film Electrode"},"content":{"rendered":" \r\n
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Image of Nissha IME Manufacturing Process<\/h3>\r\n<\/div>\r\n\r\n
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    1. When embedding electrodes on the surface side of injection molded parts (Connection method: Metallic pin)<\/p>\"1.<\/li>\r\n

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    2. When embedding electrodes on the backside of injection molded parts (Connection method: FPC connector)<\/p>\r\n \"2.\r\n <\/li>\r\n<\/ol>\r\n\r\n<\/div>\r\n

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    Samples Available<\/h3>\r\n

    We have actual samples available for you to view. There are multiple structural patterns available.
    \r\nPlease feel free to contact us if you are interested.<\/p>\r\n\r\n<\/div>\r\n<\/div>\r\n

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    \"Samples<\/div>\r\n
    \"Samples<\/div>\r\n<\/div>\r\n
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    Inquiries\"\"<\/a><\/p>\r\n\r\n<\/div>\r\n

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    Comparison of Conventional Methods and Nissha IME<\/h2>\r\n

    To form electrodes and circuits on curved and uneven molded resin surfaces, methods such as LDS (Laser Direct Structuring), which is one of the MID technologies, and attaching electrode films and FPC using adhesives like double-sided tape have been used.
    \r\nHowever, both methods have weaknesses, such as limitations on the shapes and electrode patterns that can be handled, increased labor, and costs.
    \r\nNissha IME solves these problems and is a technology that can be applied to a wider range of products.<\/p>\r\n\r\n<\/div>\r\n

    LDS Method:<\/h3>\r\n
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