Parts with electrodes and circuits formed on 3D molded resin are called MID（Molded Interconnect Device）.
NISSHA IME is one of MID’s new construction methods. So what kind of construction method does MID have? Introducing the difference between the conventional method of MID and the NISSHA IME.
What is MID？
“MID” means Parts in which electrodes, circuits, etc. are formed on the surface of a three-dimensional molded resin.
“MID” is an abbreviation for Molded Interconnect Device.
With the development of MID, circuit formation and component mounting, which could only be realized（has been limited） on a flat surface, have become possible even with a three-dimensional shape.
As a result, it has become possible to design electrical appliances, which were often flat in the past, into three-dimensional and complex shapes, and to make them thinner, lighter, and smaller.
MID construction method
The conventional MID construction methods can be broadly classified into two types:”the double molding method” and “the single molding method”.
LDS (laser direct structuring), which is a typical the single molding method, is currently the most widely used method.
It is necessary for LDS method to use particular resin.
The catalyst is activated by irradiating the part to be patterned with a laser, and the electrode is formed by electroless plating.
The molded resin with a three-dimensional circuit made by LDS are compatible with small electronic devices with limited space, and are often used for antennas, as well as for connectors and switches.
NISSHA IME is a technology that realizes the forming of electrodes and circuits on a three-dimensional molded resin by a method completely different from the conventional MID method.
NISSHA IME has many unique benefits.
NISSHA IME realizes a structure that cannot be achieved by conventional methods.
In the NISSHA IME method, a film or FPC on which an electrode circuit or sensor pattern is printed is prepared in advance, and they are inserted into a mold for injection molding to integrate the circuit at the same time as molding the resin product.
The density of the circuit can be increased by using a film or FPC with electrode circuits formed on both sides.
In addition, it is possible to further increase the degree of integration by integrating FPCs with electronic components solder-mounted in advance.
●More freedom to choose the material and color of molding resin
The LDS method requires a particular resin containing a catalyst, and general molding resin and transparent resin cannot be used.
On the other hand, general molding resin can be used in NISSHA IME.The material and color of the resin can be freely selected, and transparent resin is also supported, so it can be applied to parts that want to transmit light and designs that require transparent windows such as displays.
●Selectable connection method to PCB
Generally, in the LDS method, the spring pin mounted on the board is brought into contact with the electrode formed by LDS.
With NISSHA IME, in addition to connecting with spring pins, you can extend the FPC to be inserted and connect it with a FPC connector.
●Unique Shapes by NISSHA IME
NISSHA IME realizes a shape that can only be achieved with NISSHA IME by taking advantage of the difference from the conventional method.
It is possible to insert electrodes inside a tubular molded product or inside a deeply drawn shape.
In NISSHA IME, you can choose from multiple combinations of which layer of the part you want to insert the electrodes into and how they are electrically connected to the board.
The position of the electrodes and the method of electrical connection with the board are important in product design.
We will propose a combination that suits your needs.
Case1 Electrode on front
Pin connecrion
Case2 Electrode on back
FPC connecrion
Pin connecrion from PCB
For more detail, actual samples are prepared, by multiple construction variations.
Please feel free to contact us for your interest.
Please feel free to contact us.
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