New MID technology! Advantages of NISSHA IME

New MID technology! Advantages of NISSHA IME

Parts with electrodes and circuits formed on 3D molded resin are called MID(Molded Interconnect Device).
NISSHA IME is one of MID’s new construction methods. So what kind of construction method does MID have? Introducing the difference between the conventional method of MID and the NISSHA IME.

What is MID?

“MID” means Parts in which electrodes, circuits, etc. are formed on the surface of a three-dimensional molded resin.
“MID” is an abbreviation for Molded Interconnect Device.
With the development of MID, circuit formation and component mounting, which could only be realized(has been limited) on a flat surface, have become possible even with a three-dimensional shape.
As a result, it has become possible to design electrical appliances, which were often flat in the past, into three-dimensional and complex shapes, and to make them thinner, lighter, and smaller.

MID construction method

The conventional MID construction methods can be broadly classified into two types:”the double molding method” and “the single molding method”.
LDS (laser direct structuring), which is a typical the single molding method, is currently the most widely used method.

LDS method

It is necessary for LDS method to use particular resin.
The catalyst is activated by irradiating the part to be patterned with a laser, and the electrode is formed by electroless plating.

The molded resin with a three-dimensional circuit made by LDS are compatible with small electronic devices with limited space, and are often used for antennas, as well as for connectors and switches.


NISSHA IME is a technology that realizes the forming of electrodes and circuits on a three-dimensional molded resin by a method completely different from the conventional MID method.
NISSHA IME has many unique benefits.
NISSHA IME realizes a structure that cannot be achieved by conventional methods.


In the NISSHA IME method, a film or FPC on which an electrode circuit or sensor pattern is printed is prepared in advance, and they are inserted into a mold for injection molding to integrate the circuit at the same time as molding the resin product.
The density of the circuit can be increased by using a film or FPC with electrode circuits formed on both sides.
In addition, it is possible to further increase the degree of integration by integrating FPCs with electronic components solder-mounted in advance.

Advantages of NISSHA IME compared to LDS method

More freedom to choose the material and color of molding resin

The LDS method requires a particular resin containing a catalyst, and general molding resin and transparent resin cannot be used.
On the other hand, general molding resin can be used in NISSHA IME.The material and color of the resin can be freely selected, and transparent resin is also supported, so it can be applied to parts that want to transmit light and designs that require transparent windows such as displays.

Achieve finer wiring and multi-layer circuits

By insert molding FPC, it is possible to form fine circuits that were not possible with conventional MID methods.
Furthermore, it is possible to insert a multi-layer FPC, which makes it possible to form a circuit with higher density than the conventional method.

Selectable connection method to PCB

Generally, in the LDS method, the spring pin mounted on the board is brought into contact with the electrode formed by LDS.
With NISSHA IME, in addition to connecting with spring pins, you can extend the FPC to be inserted and connect it with an FPC connector, or you can set up pins for electrode connection at the same time as molding.

Supports large sizes

There is a limit to the size that can be handled by conventional MID technology.
NISSHA IME can be applied not only to small sizes but also to large sizes up to 800 mm.
Therefore, it is also suitable for use in forming circuits required for various functions such as the operation panel of electronic devices, touch panels, switches, and antennas.

Unique Shapes by NISSHA IME

NISSHA IME realizes a shape that can only be achieved with NISSHA IME by taking advantage of the difference from the conventional method.

It is possible to insert electrodes inside a tubular molded product or inside a deeply drawn shape.

Variations of layer construction to form electrodes and methods to connect to PCB

In NISSHA IME, you can choose from multiple combinations of which layer of the part you want to insert the electrodes into and how they are electrically connected to the board.
The position of the electrodes and the method of electrical connection with the board are important in product design.
We will propose a combination that suits your needs.

Case1 Electrode on front

Pin connecrion

FPC connecrion

  • Antenna or sensor above resin
  • 2 options for connection, Pin connection thought resin or FPC.
  • Good for antenna / sensor performance
  • By inserting the decorative layer on the outermost surface, high design quality can be achieved.
  • You can choose whether or not to have a decorative layer.

Case2 Electrode on back

FPC connecrion

Pin connecrion from PCB

  • Antenna or sensor under resin
  • 2 options for connection, FPC or Pin connection from PCB.
  • By inserting the decorative layer on the outermost surface, high design quality can be achieved.
  • You can choose whether or not to have a decorative layer.

Case3 Electrode on front and back

FPC and PIN connecrion

  • Antenna or sensor under & above resin
    For example, Anntena on top, and touch switch on backside on single parts.
  • Each layers are connected to PCB by PIN and FPC connecter.
  • One injection process to get 2 type of electrode at front and back and decoration.
  • By inserting the decorative layer on the outermost surface, high design quality can be achieved.
    You can choose whether or not to have a decorative layer.

Concept samples are ready

For more detail, actual samples are prepared, by multiple construction variations.
Please feel free to contact us for your interest.


Please feel free to contact us.