No need for double-sided tape!
Integrate electrode into parts with NISSHA IME

Fix the board without using double-sided tape!
Insert molding of electrode film and FPC into parts

In NISSHA IME, functional parts such as electrode film and FPC are integrated with resin parts by insert molding.
Therefore, there is no need for adhesives such as double-sided tape that have been used for fixing.
It has the advantages of simplifying the product structure, reducing the number of parts and assembly process, and improving reliability.

Advantages of NISSHA IME compared to the laminating method

Realization of thin and lightweight products

Functional electrodes can be integrated into parts without using adhesives such as double-sided tape with NISSHA IME.
Therefore, it is the most suitable technology for making products thinner and lighter.

Integrate electrodes even for parts with concave shapes and ribs/bosses

When fixing the electrode film or FPC with double-sided tape, it is necessary to bond them by hand or roller.
Manual work incurs large costs such as labor costs and work time.
The roller bonding method cannot handle curved surfaces where there are ribs/bosses that interfere with the rollers, or where pressure is not evenly applied.
In NISSHA IME, FPC and electrode film are integrated by insert molding, so there is no problem with such a shape.

Improved reliability

Adhesives such as double-sided tape are prone to deterioration due to environmental factors such as vibration, ultraviolet rays, temperature and humidity, and may cause problems such as reduced adhesive strength, generation of bubbles, and discoloration (yellowing).
The resin and film are bonded by the heat of molding in NISSHA IME.
It eliminates the need for adhesives and solves these reliability issues.
In addition, because it can realize a seamless shape, it is also excellent in waterproof and dustproof properties.

Supports minute spaces that are difficult to bond

In electrical appliances that are becoming smaller and thinner, there is an increasing need to place electrodes and sensors in minute spaces.
In addition, the strength of adhesives such as double-sided tape decreases as the area to be bonded becomes smaller.
Bonding to a small space requires laborious manual work, which is costly and time consuming.
Electrodes and sensors can be firmly fixed by insert molding even in such a small space with NISSHA IME.

Layer structure by NISSHA IME

This section describes the layer structure when electrodes are inserted in NISSHA IME.
For the electrical connection method between the electrode and the board, you can select the FPC connector or the spring terminal or pin mounted on the board.

Pin connection

FPC connection

  • Antenna or sensor under resin
  • 2 options for connection, FPC or Pin connection from PCB.
  • By inserting the decorative layer on the outermost surface, high design can be achieved.
    You can choose whether or not to have a decorative layer.

Comparison of Nissha IME and conventional roller lamination process

Roller Lamination IME
curved surface Up to 2D geometry 3D surface is feasible
(MAX:R500xR700)
No backside feature in specific area Restricted
(Due to a range lamination roller motion)
Free from roller dia. restriction

Various adhesive related quality issues

Various issues occurs in adhesive due to aging, environmental influence such as high temperature / high humidity and vibrations.

Bubbles

Bubbles caused at lamination process or at usage under certain emviroment. It may change sensor and anntena properties, and cause visual defect on display.

Delamination

Delamination caused by aging or vibration. It may change sensor and anntena properties, and cause visual defect on display.

Yellowing

Yellowing caused by aging or at usage under certain environment. It may cause visual defect on display.

Moisture absorption

Adhesive absorb moisture. It may cause change of dielectric constants and change sensor and anntena properties.

Mulfunction under high temperature

Delamination issued by high temperature environment causes to change sensor and anntena properties.

Mulfunction at low temperature

Adhesive at low temperature may change dielectirc constants and change sensor and anntena properties.

Testing environment

NISSHA have various testing facilities.

These are examples of reliability test spec applied to Nissha IME for home appliance applications.
We can perform reliability test by our ih-house testing enviroment, feedback the result to design team, and can propose most appropriate design to customers.

High temperature storage Low temperature storage High temperature high humidity storage Heat cycle UV resistance
+70°C
240Hrs
-40°C
240Hrs
+60°C/93%Rh
240Hrs
-25°C/1Hrs
⇔+60°C/1Hrs
10cyc.
Xenon
weathermeter

Inquiry

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