More freedom in design

Benefit of Nissha IME molding technology for 3D circuit patterning and construction design

NISSHA IME is a technology of MID (Molded Interconnect Device). Film electrode is integrated on molded parts by insert molding, even on 3D or curvature, where conventional assembly method or plating technology such as LDS cannot. You can save some process steps. NISSHA can propose the most appropriate construction to customers including stack-up of film electrode and its output method.

Integration of film electrode to 3D complex surface

NISSHA IME can integrate film electrode into complex shapes with curved surface and structures.
Not using adhesive layer, it works with thinner and complex construction, reduces components numbers and process steps and improve the quality.

Process of NISSHA IME

①Electrode placed on surface side of injection molded parts(Connection to electrode: Metallic pin)

Electrode placed on surface side of injection molded parts

②Electrode placed on backside of injection molded parts(Connection to electrode : FPC)

Electrode placed on backside of injection molded parts

Examples: Comparison to other methods by integration of antenna to 3d surface

Integrating exterior and antenna parts contributes to make parts smaller.
Variety of CMF expression that can not be achieved by painting is possible by Nissha decoration IMD technology
The antenna sensitivity can be improved by placing near the surface of the product
Simple and easy connection to PCB by a choice from either PIN or FPC

Assembly cost of exterior and antenna parts require connection construction and labor.
antenna sensitibity is deteriorated by exterior parts
Method to connect PDB is limited to spring pin or soldering
antenna parts require expensive resin grade

Adhesive lamination tend to cause delamination issue
impossible to laminate to a shape which can not apply pressure such as concave surface
Total cost is increased due to low yield
Residue pressure of assembly due to spring pin or FPC shape influence laminated antenna

Design optimization

NISSHA IME offers choices of film electrode position and circuit output way.
We offer most suitable proposal for your design and usage.

Variation of methods to connect to PCB

PINS	FPC connectors

PINS

1 Electrode patterned on the back side of decoration film is put over the molded part.
Inserted pins connected to electrode work as circuit output.

FPC connectors

2 Electrode patterned on the back side of decoration film is put over the molded part.
Extended circuit from film electrode work as circuit output.

FPC connectors

2 Electrode patterned on the back side of decoration film is put behind the molded part.
Extended circuit from film electrode work as circuit output.

Variations of layer construction to form electrodes

①An electrode placed right beneath surface decoration film

Connection to PCB ： PIN

Connection to PCB ： FPC connector

As antenna electrode is close to top surface, you can expect better antenna sensitivity.
Decoration and antenna electrode applied on both side of base film for an insert mold.
Connection method to PCB could be chosen either from FPC or PIN.

②An electrode placed on backside of panel

Connection to PCB ： FPC connector

Connection to PCB ： Spring pin on PCB

Possible to integrate electrode to decorative parts along with high quality finisher expression
decoration + antenna electrode film, and functional electrode film inserted at one shot.
Connection method to PCB could be chosen either from FPC or spring PIN on PCB.

③An electrode placed right beneath surface decoration film and An electrode placed on backside of panel

Connection to PCB ： Pin and FPC connector

Possible to locate electrode for both outside and inside of finisher resin parts.
For example, antenna on top, and touch switch on backside on single parts
Decoration and antenna electrode applied on both side of base film for an insert mold.
Separately made electrode film to be inserted on backside to mold simultaneously.
Each layers are connected to PCB by PIN and FPC connecter.

Concept samples are ready

For more detail, actual samples are prepared, by multiple construction variations.
Please feel free to contact us for your interest.

Inquiries

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COMPACT, THIN, LIGHT

By Integration of film electrode and functional parts such as LED to cover parts, NISSHA IME do not need adhesive layer and cuircuit board for sensor. It enables simpler assembly and reduces component and process numbers, and improvement of reliability.

Application example : Electronic home apliance control panel

NISSHA IME can integrate LEDs on film electrodes by insert molding. And contribute to reduce number of components and achieve smaller PCB or thinner products

Conventional Construction

Nissha IME

Contributes to solve lamination issues by roller lamination to such as concave surface

Comparison of Nissha IME and conventional roller lamination process

In order to laminate thin film shaped sensors or electrodes to plastic molded parts, it is necessary to apply roller lamination method by elastic plastic based or double sided tape type of adhevsives.

It is necessary to apply adequate pressure by roller to laminate, therefore roller lamination process is unable to apply to cases such as to laminate near obstacles like libs, or concave surface a uniform pressure is unable to be applied.

On the other hand, as NISSHA IMD integrates film sensors or electrodes by insert molding process, it is possible to apply to such a complex geometry.

	Roller Lamination	IME
curved surface	Up to 2D geometry	3D surface is feasible (MAX：R500xR700）
No backside feature in specific area	Restricted (Due to a range lamination roller motion)	Free from roller dia. restriction

Examples of our development

UI panel integrated electrode/sensor

Material Insert

Elastomer button

Rader cover

Learn more

About co-development

NISSHA have CMF designers internally. With full knowledge of Nissha’s technology, production cost and productivity, they can offer the design most appropriate to customer from concept stage.