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Semi-Additive Process (SAP) for circuit patterning

Process development for achieving both lower resistance and narrower line width pattern on transparent film

NISSHA is developing the SAP process.
We add high value to the flexible substrates utilizing fine patterning technology.
The technology may be applicatble to various products such as transparent antennas.

Features

High transparency

High optical transparency is enabled by fine patterning capability and intrinsic optical properties of substrate material, COP.

Narrower and thicker trace pattenring

Both low electrical resistance and narrow line width are attained due to fine patterning and plating technologies.

Large area

Our current manufacturing line consists of both roll-to-roll and sheet-to-sheet processes. We will be launching a fully roll-to-roll line that can process 500mm width webs for mass production.

Process flow

SAP has the following features compared to subtractive process.

・Narrow traces can be patterned
・Thickness of Cu can be adjusted
・Rectangular cross section of traces

SAP
(under development)		 Subtractive process
(NISSHA conventional process)

NISSHA is developing the metal mesh pattaning process for transparent antennas

・Fine wire mesh
We have achieved 2.5μm width with less than 5μm thickness.

・Blackend copper mesh
We are developing the blackennig process that contributes to the reduction of mesh visiibility.

・Anti-star-effect pattern
We can design the anti-star-effect pattern.

Applications

Transparent antenna

Transparent LED light

Coil alternative FPC

Process with lower environmental impact

Copper consumption is expected to be reduced for 70% by changing the process from Subtractive to Semi-Additive.

*Estimate conditions
10μm thick Cu, traces cover 30% of the entire surface.

Inquiries about Semi-Additive Process (SAP)

Please feel free to contact us for any questions or concerns.

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